Pin Fin Cold Forged Aluminum Heatsink

Cold forged pin fin aluminum heatsink, monolithic forming. Dense cylindrical pins maximize heat dissipation area. Designed for passive cooling of LED lights and power supplies. Full customization of diameter, height, pin size & pitch available. Anodizing option for better corrosion resistance & thermal radiation.
Pin Fin Cold Forged Aluminum Heatsink,Grace Metal
Case Details
Project Background:
The customer’s original heatsinks adopted extruded profiles and assembled pin fins. Under long-hour operation of high-power lamps, temperature rise exceeded limits. Assembly joints introduced interface thermal resistance, leading to obvious performance degradation, which failed the reliability standards for lighting products in European and American markets. The client was looking for an integrated, high-efficiency, flexibly sized passive cooling solution. We undertook the full customization workflow including thermal simulation, structural optimization, mold development, sample verification and mass delivery.

Client Requirements:
1.Monolithic heatsink without bonding interface to eliminate thermal resistance
2.Maximize heat dissipation area within given outer diameter to limit LED temperature rise
3.High flatness base compatible with existing LED MCPCB mounting structure
4.Anodizing available for corrosion resistance and improved radiative heat dissipation
5.Customizable dimension: outer diameter, total height, pin diameter and pitch adjustable by power
6.Stable batch consistency, full test reports available for overseas inspection

Processing Technology

Core Process: Room-temperature monolithic cold forging + CNC precision machining Workflow:

  1. Aluminum billet cutting & incoming inspection
  2. High-pressure cold forging, forming base and all pin fins in one stroke
  3. CNC milling for flat base, counterbores and locating slots
  4. Optional surface anodizing or other finishing
  5. Full inspection, sampling performance test, packing & shipment

Project Achievements
1.Resolved overheating issue; heat dissipation area increased by over 40% vs extruded sunflower heatsinks of same diameter
2.Zero-interface structure, much lower thermal performance degradation during long continuous operation than assembled pin fins
3.Serial sizes from 30W to 150W developed, all samples passed reliability test and moved to mass production
4.Stable yield & controllable lead time, compatible with FOB, DDP and other trade terms

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